MECHANIC XP5 (42g)

MECHANIC XP5 (42g) is a specialized low-temperature solder paste designed primarily for micro-soldering and motherboard repair of high-end smartphones. 

Key Specifications

·         Melting Point: 148°C (Low temperature).

·         Weight: 42g.

·         Flux Type: IPX7.

·         Particle Size: 4.3 microns (Type 4.3#).

·         Storage: 0–10°C, with a typical shelf life of 12 months. 

Primary Applications

·         iPhone Repairs: Specifically optimized for the layered mainboards of iPhone X, XS, XR, and XS Max.

·         Precision Soldering: Suitable for BGA (Ball Grid Array) reballing and soldering small components where excessive heat might damage sensitive parts. 

Product Performance

·         Viscosity: Moderate viscosity prevents shifting of components during soldering.

·         Finish: Produces bright and full solder joints without false soldering or residue.

·         Wettability: High wettability and excellent weldability for consistent results in professional repairs.