Mechanic XGSP40 35G
Mechanic XGSP40 35G is a popular, high-quality solder paste used for electronics repair, especially for BGA, SMD, and SMT work on mobile phones and circuit boards, featuring a specific 183°C melting point (Sn63/Pb37 alloy) for easy welding, bright joints, and excellent flow, coming in a 35g container. It's known for performance, low residue, and suitability for automated or manual soldering with a hot air gun or iron, making it a go-to for precision electronics assembly.
Key Features & Specs:
- Product: Mechanic XGSP40 Solder Paste (Flux Cream).
- Weight: 35 grams (35g).
- Melting Point: 183°C (Medium Temperature, Leaded).
- Alloy: Sn63/Pb37 (Tin/Lead).
- Particle Size (Microns): 20-38µm or 25-45µm (varies slightly by source).
- Application: Mobile phone chip repair, BGA reballing, SMT/SMD soldering, PCB rework.
- Benefits: High quality, bright joints, good flow, no false soldering, anti-oxidation, small residue.
- Usage: Can be applied with a spatula and heated with a soldering iron, hot air gun, or reflow oven.