RF4 RF-FT11
The RF4 RF-FT11 is a professional-grade clamping fixture designed for mobile phone PCB and IC chip repair. Made from high-temperature resistant tempered glass, it provides a stable and precise platform for motherboard work, BGA soldering, IC replacement, and micro-soldering.
Specifications
- Model: RF4 RF-FT11
- Material: High-temperature resistant tempered glass + durable frame
- Function: PCB/IC/BGA clamping for repair, soldering, and testing
- Platform Size: Standard motherboard dimensions (fits most mobile phone PCBs)
- Clamping Type: Adjustable pressure clips for secure holding
- Temperature Resistance: Safe for high-temperature rework (up to ~300°C)
- Application:
- Mobile phone motherboard repair
- BGA chip soldering/rework
- IC replacement