ALPHA OM-550
Alpha om-550 is a modern low-temperature, no-clean solder paste, formulated for sensitive and high-complexity pcb assemblies — especially useful for boards with heat-sensitive components, warpage-prone substrates, or bga / fine-pitch parts. Its specially paired alloy (hrl1 alloy) provides improved thermal-cycling and drop-shock resistance compared to conventional low-temperature solder pastes. Om-550 is designed to reduce common defects such as warpage, non-wet-open (nwo) or head-in-pillow (hip) when reflowing complex assemblies
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Feature
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Specification / Detail
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Product Name
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Alpha OM-550 Solder Paste
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Alloy
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HRL1 alloy (lead-free)
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Reflow Peak Temperature
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~ 175 °C (for low-temp process) ~ 185–195 °C when mixed-alloy process used
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Powder / Paste Type
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Solder paste, available in Type 4 (fine-powder) — suitable for fine-pitch / fine-feature printing.
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Flux / Cleanliness
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No-clean, low-residue, lead-free (RoHS compliant), zero halogen. (
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Stencil / Printing Performance
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Fine-feature printing capable, with stable print volume and quality for complex boards.
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Reliability Benefits
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Improved drop-shock and thermal-cycling reliability, reduced warpage (up to 99% vs. standard SAC process), enhanced BGA mechanical reliability.
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Defect Reduction
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Minimizes Non-Wet-Open (NWO) and Head-in-Pillow (HIP) defects; good voiding performance on packages like BGA, MLF, DPAK, LGA. (
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Reflow Environment
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Works in air or nitrogen reflow processes.
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Packaging / Jar Size
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Commonly supplied in 500 g jars.
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Compliance
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Lead-free, RoHS compliant, zero-halogen.
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