RELIFE HW21S

RELIFE HW21S is a professional-grade, leaded silver solder paste engineered with a medium-temperature melting point of 183°C. It is heavily utilized in micro-soldering electronics repair, particularly for smartphone motherboards, BGA reballing, SMT patches, and LED mounting.

Core Specifications

·         Composition: Contains both Lead (Pb) and Silver (Ag). The silver addition vastly improves electrical conductivity and mechanical joint strength.

·         Melting Point: 183°C, which is the optimal medium temperature required to safeguard delicate, heat-sensitive micro-components.

·         Form Factor: Packaged in a convenient 10cc transparent syringe tube, reducing material waste.

·         Viscosity: Engineered with moderate humidity and viscosity to prevent clumping, component shifting, or structural collapse during application.

Key Performance Benefits

·         No-Clean Formula: The paste is non-corrosive to PCBs, leaves minimal residue, and eliminates the time-consuming post-soldering cleanup phase.

·         Zero False Jointing: Exceptional wettability and smooth wetting properties ensure full tinning with bright, fully-formed solder joints.

·         Oxidation Resistant: The alloy provides high resistance to oxidation, guaranteeing the long-term reliability of repaired electronics.

Package Inclusions

·         1 × 10cc Syringe of HW21S Paste

·         1 × Plunger/Push Rod

·         3 × Dispensing Needles of varying diameters for fine precision work