RELIFE RL-404S

RELIFE RL-404S is a professional-grade, low-temperature lead-free solder paste tailored for precision electronics and smartphone motherboard repairs.

Key Technical Specifications

·         Alloy Composition: Sn42/Bi58 (Tin/Bismuth)

·         Melting Point: 138°C (Ideal for heat-sensitive components)

·         Volume: 10cc / 10ml syringe

·         Particle Size: 20–38 µm (Ultra-fine for micro-soldering and stencils)

·         Flux Content: 9 ± 0.5 Wt% (No-clean formula)

·         Viscosity: 178 ± 10 Pa·s

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Key Features & Benefits

·         Thermal Protection: The low 138°C melting point minimizes the risk of overheating and blistering delicate PCB tracks, sensors, or nearby ICs during reballing.

·         Syringe Design: Packaged in a syringe form factor with an included needle tube and plunger (putter) to permit precision dispensing with minimal material waste.

·         High Performance: Delivers strong activity, excellent wettability (remains usable for up to 36 hours after opening), and leaves bright, full solder joints.

·         Extended Shelf Life: Lasts up to 12 months when stored properly in a refrigerated environment (0–10°C).

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Common Applications

·         BGA Reballing: Frequently used for high-end smartphone repair (e.g., iPhone and Huawei logic boards).

·         SMD/SMT Repairs: Ideal for small-outline components like QFP and QFN packages.

·         Heat-Sensitive Items: Perfect for soldering LEDs, flexible cables, and delicate connectors that melt easily.