2UUL DA28 FlatCut Solder Pad Underfill Glue Fast Removal/Cleaning Blades
The 2UUL DA28 FlatCut Solder Pad Underfill Glue Fast Removal Blades are precision repair blades designed for cleaning and removing underfill glue and residual adhesive around CPU IC chips and solder pads on mobile phone motherboards. Featuring an ultra-sharp, thin flat-cut profile, these blades are designed to slide beneath IC footprints for controlled adhesive removal while helping protect delicate copper traces. Each box contains 5 pieces, making it a practical tool set for professional motherboard repair and rework.
Specifications
- Product Type: Underfill Glue Removal Blades
- Model: 2UUL DA28
- Design: Ultra-Sharp FlatCut Profile
- Application: CPU IC & Solder Pad Cleaning
- Use: Underfill Glue & Adhesive Removal
- Quantity: 5 Pieces / Box
- Application Area: Mobile Phone Motherboard Repair