RELIFE RL-402 Medium-Temperature Soldering Paste 183°C
The RELIFE RL-402 Soldering Paste is designed for precision soldering and electronic component repair. Featuring a Sn63/Pb37 alloy with a melting point of 183°C, it is suitable for mobile phone PCB repair, surface-mount technology (SMT) soldering and BGA chip reballing.
Its no-clean formulation is intended for electronics repair applications where controlled solder paste application is required. This paste is suitable for technicians working on smartphone motherboards, computer circuit boards and other electronic assemblies.
Specifications
-
Brand: RELIFE
-
Model: RL-402
-
Type: No-Clean Soldering Paste
-
Alloy Composition: Sn63/Pb37
-
Melting Point: 183°C
-
Temperature Grade: Medium Temperature
-
Function: Soldering and BGA Reballing
-
Applications: Mobile Phone PCB Repair, SMT Soldering, Computer Circuit Boards and Electronics Maintenance