RELIFE RL-044 SAMEU4 Precision BGA Stencil

The RELIFE RL-044 SAMEU4 Precision BGA Stencil is designed for precision CPU reballing and micro-soldering during Samsung smartphone motherboard repair. Made from heat-resistant stainless steel, its ultra-thin 0.12mm design supports accurate solder ball placement on compatible Samsung Exynos CPU chipsets.

Featuring precision-cut soldering holes, a specialized half-etching design and heat-dissipation holes, this stencil helps improve alignment and manage heat during hot-air rework. It is suitable for professional technicians performing CPU reballing and chip-level motherboard repairs.

Specifications

• Brand: RELIFE

• Model: RL-044 SAMEU4

• Type: Precision BGA Reballing Stencil

• Material: Heat-Resistant Stainless Steel

• Thickness: 0.12mm

• Hole Design: Precision-Cut Round and Square Configurations

• Stencil Design: Half-Etching Structure

• Cooling Feature: Integrated Heat-Dissipation Holes

• Function: CPU Reballing and Solder Ball Placement

• Compatibility: Compatible Samsung Exynos CPU Chipsets

• Application: Samsung Smartphone Motherboard Repair and Micro-Soldering