RELIFE RL-044 IPZ14 Precision BGA Reballing Stencil
The RELIFE RL-044 IPZ14 Precision BGA Reballing Stencil is designed for precision CPU reballing and solder ball placement during iPhone motherboard repair. Made from thin, durable steel, it features a 0.12mm thickness to support accurate alignment and detailed micro-soldering work.
This stencil is intended for compatible iPhone CPU layouts and helps technicians perform CPU reballing and soldering maintenance during board-level repairs. It is suitable for professional mobile phone repair technicians working with supported A15/A16 CPU configurations.
Specifications
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Brand: RELIFE
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Model: RL-044 IPZ14
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Product Type: Precision BGA Reballing Stencil
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Material: Steel
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Thickness: 0.12mm
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Function: CPU Reballing and Solder Ball Placement
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Compatibility: iPhone 14, iPhone 14 Plus, iPhone 14 Pro, iPhone 14 Pro Max
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CPU Compatibility: Supported A15/A16 CPU layouts
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Application: iPhone Motherboard Repair and Micro-Soldering