RELIFE RL-044 SAM14 Precision BGA Reballing Stencil

The RELIFE RL-044 SAM14 Precision BGA Reballing Stencil is designed for accurate CPU and power IC reballing on compatible Samsung smartphone motherboards. Made from high-temperature-resistant stainless steel with a thickness of 0.12mm, it features precision-cut soldering holes to support uniform solder ball placement during chip repair.

Its half-etching design and integrated heat-dissipation holes help manage heat during rework and support precise soldering operations. This stencil is suitable for professional mobile phone technicians performing BGA reballing, CPU maintenance, and motherboard-level IC repairs on compatible Samsung Exynos processor layouts.

Specifications

• Brand: RELIFE

• Model: RL-044 SAM14

• Product Type: Precision BGA Reballing Stencil

• Material: High-Temperature-Resistant Stainless Steel

• Thickness: 0.12mm

• Hole Design: Precision-Cut Round and Square Patterns

• Structure: Half-Etching Design with Heat-Dissipation Holes

• Functions: CPU Reballing, Solder Ball Placement, Power IC Repair

• Compatibility: Selected Samsung Galaxy A-Series Models and Compatible Exynos CPU Layouts

• Supported CPU Series: Exynos 7870, 7884, 7885, 7904, 9610, 9611

• Applications: Samsung Motherboard Repair, BGA Reballing, Micro-Soldering